Archive: 07/05/2004
Samsung Electronics Develops Wafer Level Package for Higher Chip Performance
Samsung Electronics Co., Ltd., the world leader in advanced semiconductor memory technology, recently announced the industry's first wafer level package (WLP) for high-performance 512Megabit (Mb) DDR2 SDRAMs. WLP, unlike ...
Jul 05, 2004 |
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Micron Announces Plans to Produce NAND Flash Memory Products
Boise, ID July 5, 2004 – Micron Technology, Inc., today announced plans to produce NAND Flash memory solutions targeting memory cards, USB devices and other mass storage applications. The growing demand for high-performance, ...
Jul 05, 2004 |
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New Separation Technology With Carbon Dioxide Is Cleaner And Cheaper
Researchers of Wageningen University and Research Centre in the Netherlands have developed a new clean, process to isolate valuable or undesired components from solids, such as components for food products. In contrast to ...
Jul 05, 2004 |
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Beating the Thieves With Location Tracking Technology
Police aim to 'design out' crime by equipping valuable items with tracking devices that sound an alert or record their movement. They are being helped by electronic engineers at the University of Leeds who are devising a ...
Jul 05, 2004 |
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Samsung Electronics Unveils Next-generation Technology Breakthroughs
Samsung Electronics Co., Ltd., a leader in advanced semiconductor technology, presented a wide range of core next-generation technologies at the 2004 Symposia on VLSI Technology and Circuits, being held in Honolulu June 15-19. ...
Jul 05, 2004 |
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New Technology Could Transform Every Train into A High Speed Cracked Rail Detector
Researchers in the University of Warwick’s Department of Physics have developed a novel non-contact method of using ultrasound to detect and measure cracks and flaws in rail track – particularly gauge corner ...
Physics /
Jul 05, 2004 |
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