Archive: 06/14/2004
International SEMATECH Identifies Top Technical Challenges for 2005
International SEMATECH released its Top Technical Challenges for 2005, re-emphasizing advanced gate stack, 193nm immersion and EUV lithography, and low-k dielectrics, and placing 3-D interconnect on the list for the first ...
Jun 14, 2004 |
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Elpida Memory Expands Semiconductor Production Facilities
Construction Begins on Second 300 mm Fabrication Plant and First 300 mm Fab Set to Boost Mass Production Hiroshima, June 10, 2004 - Elpida Memory, Inc (Elpida), Japan's leading global supplier of Dynamic Random Access Memor ...
Jun 14, 2004 |
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Motorola Introduces Scalable 10/20 Gigabit per Second Ethernet Platform for Streaming Video-on-Demand Transport
The new Motorola Multiservice Wavelength Transport Ethernet Aggregation 200 (MWT EA 200) combines high density Ethernet aggregation with optical transport. HORSHAM, Pa. – 14 June 2004 – Motorola, Inc. today introduced the ...
Jun 14, 2004 |
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Infineon Introduces Innovative, Space-Saving and Power-Saving Memory Products for Mobile and Handheld Applications
Munich, Germany – June 14, 2004 – Infineon Technologies AG today announced new memory products for mobile applications such as notebooks, and for handheld products like cellular phones and PDAs, extending the company’s broad ...
Jun 14, 2004 |
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Intel Begins 300 MM Production At Newest Wafer Fabrication Facility In Ireland
LEIXLIP, Ireland, June 14, 2004 - Intel Corporation's newest high-volume wafer fabrication facility has commenced production. Fab 24, a $2 billion facility, features 300 mm wafer manufacturing based on Intel's leading 90 ...
Jun 14, 2004 |
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Sandia polymer electrolyte membrane brings goal of a high temperature PEM fuel cell closer
ALBUQUERQUE, N.M. — A new type of polymer electrolyte membrane (PEM) is being developed by researchers at the Department of Energy’s Sandia National Laboratories to help bring the goal of a micro fuel cell closer to realization ...
Physics /
Jun 14, 2004 |
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Breakthrough triple-oxide 90nm technology reduces power consumption by 50 percent
New technology used to manufacture Virtex-4 FPGAs expected to cut power consumption in half while significantly increasing performance over previous generation devices HSINCHU, Taiwan, and SAN JOSE, Calif., June 14, 2004 - X ...
Jun 14, 2004 |
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