Breakthrough triple-oxide 90nm technology reduces power consumption by 50 percent
Jun 14, 2004 |
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New technology used to manufacture Virtex-4 FPGAs expected to cut power consumption in half while significantly increasing performance over previous generation devices HSINCHU, Taiwan, and SAN JOSE, Calif., June 14, 2004 - X ...
Sandia polymer electrolyte membrane brings goal of a high temperature PEM fuel cell closer
Physics /
Jun 14, 2004 |
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ALBUQUERQUE, N.M. — A new type of polymer electrolyte membrane (PEM) is being developed by researchers at the Department of Energy’s Sandia National Laboratories to help bring the goal of a micro fuel cell closer to realization ...
Intel Begins 300 MM Production At Newest Wafer Fabrication Facility In Ireland
Jun 14, 2004 |
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LEIXLIP, Ireland, June 14, 2004 - Intel Corporation's newest high-volume wafer fabrication facility has commenced production. Fab 24, a $2 billion facility, features 300 mm wafer manufacturing based on Intel's leading 90 ...
Infineon Introduces Innovative, Space-Saving and Power-Saving Memory Products for Mobile and Handheld Applications
Jun 14, 2004 |
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Munich, Germany – June 14, 2004 – Infineon Technologies AG today announced new memory products for mobile applications such as notebooks, and for handheld products like cellular phones and PDAs, extending the company’s broad ...
Motorola Introduces Scalable 10/20 Gigabit per Second Ethernet Platform for Streaming Video-on-Demand Transport
Jun 14, 2004 |
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The new Motorola Multiservice Wavelength Transport Ethernet Aggregation 200 (MWT EA 200) combines high density Ethernet aggregation with optical transport. HORSHAM, Pa. – 14 June 2004 – Motorola, Inc. today introduced the ...
Elpida Memory Expands Semiconductor Production Facilities
Jun 14, 2004 |
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Construction Begins on Second 300 mm Fabrication Plant and First 300 mm Fab Set to Boost Mass Production Hiroshima, June 10, 2004 - Elpida Memory, Inc (Elpida), Japan's leading global supplier of Dynamic Random Access Memor ...
International SEMATECH Identifies Top Technical Challenges for 2005
Jun 14, 2004 |
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International SEMATECH released its Top Technical Challenges for 2005, re-emphasizing advanced gate stack, 193nm immersion and EUV lithography, and low-k dielectrics, and placing 3-D interconnect on the list for the first ...
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