New polymer could improve semiconductor manufacturing, packaging

Researchers at Rensselaer Polytechnic Institute and Polyset Company have developed a new inexpensive, quick-drying polymer that could lead to dramatic cost savings and efficiency gains in semiconductor manufacturing and computer chip packaging.

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<p><a href="http://www.physorg.com/news120756427.html">New polymer could improve semiconductor manufacturing, packaging</a></p> <p>Researchers at Rensselaer Polytechnic Institute and Polyset Company have developed a new inexpensive, quick-drying polymer that could lead to dramatic cost savings and efficiency gains in semiconductor manufacturing and computer chip packaging.</p>