Cracking a Tough Nut for the Semiconductor Industry

(PhysOrg.com) -- Researchers at the National Institute of Standards and Technology have developed a method to measure the toughness -- the resistance to fracture -- of the thin insulating films that play a critical role in high-performance integrated circuits. The new technique could help improve the reliability and manufacturability of ICs and, better yet, it’s one that state-of-the-art microelectronics manufacturers can use with equipment they already own.

If you want to include this story in your blog, copy and paste this formatted text:

<p><a href="http://www.physorg.com/news149276313.html">Cracking a Tough Nut for the Semiconductor Industry</a></p> <p>(PhysOrg.com) -- Researchers at the National Institute of Standards and Technology have developed a method to measure the toughness -- the resistance to fracture -- of the thin insulating films that play a critical role in high-performance integrated circuits. The new technique could help improve the reliability and manufacturability of ICs and, better yet, it’s one that state-of-the-art microelectronics manufacturers can use with equipment they already own.</p>