NEC Develops a Three-Dimensional Chip-Stacked Flexible Memory

NEC Corporation announced today the development of chip-stacked flexible memory, which can be used to achieve a new system-on-chip (SoC) architecture. The new SoC's architecture consists of separate logic (excluding embedded memory cores) and memory chips (chip-stacked flexible memory) that are closely stacked by using a three-dimensional packaging technology.

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<p><a href="http://www.physorg.com/news153510219.html">NEC Develops a Three-Dimensional Chip-Stacked Flexible Memory</a></p> <p>NEC Corporation announced today the development of chip-stacked flexible memory, which can be used to achieve a new system-on-chip (SoC) architecture. The new SoC's architecture consists of separate logic (excluding embedded memory cores) and memory chips (chip-stacked flexible memory) that are closely stacked by using a three-dimensional packaging technology.</p>