Alternative Strategies May Supplant Low-k Materials Development for Future ICs

The search for low-k materials to improve semiconductor interconnects may have reached certain practical limits, according to technologists at a recent conference sponsored by SEMATECH. Future work likely will focus less on new, ultra low-k materials, and more on enhancing improvements in process and design, conference participants indicated.
Presenters at the SEMATECH Low-k Symposium, which attracted approximately 140 technologists to San Diego in late October, appeared to sustain SEMATECH's position that interconnect materials below 2.5 k-effective may be too expensive to develop and too difficult to work with to be economically practical for all design schemes.

If you want to include this story in your blog, copy and paste this formatted text: