Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the world's first eight-die multi-chip package (MCP) technology, designed for use in high-capacity mobile devices such as 3G handsets and other increasingly smaller mobile devices.
Typically, as the number of chips per memory package increases, so does the thickness of the package. Using its Wafer Supporting System technology to make wafers thinner during design processing, Samsung has been able to minimize overall die thickness as well as decrease the space between the stacked dies. As a result, the eight-die MCP solution offers an unmatched combined capacity of 3.2 gigabits in a package that is 1.4mm thick, equaling the thickness of a four-die MCP solution.