Samsung Electronics Develops Wafer Level Package for Higher Chip Performance

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor memory technology, recently announced the industry's first wafer level package (WLP) for high-performance 512Megabit (Mb) DDR2 SDRAMs. WLP, unlike conventional package technology, builds the package layer directly on the wafer by incorporating fabrication process. This new approach enhances the electrical properties and reduces the physical space making WLP an optimal package solution for mobile environments and high-density memory modules.

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<p><a href="http://www.physorg.com/news316.html">Samsung Electronics Develops Wafer Level Package for Higher Chip Performance</a></p> <p>Samsung Electronics Co., Ltd., the world leader in advanced semiconductor memory technology, recently announced the industry's first wafer level package (WLP) for high-performance 512Megabit (Mb) DDR2 SDRAMs. WLP, unlike conventional package technology, builds the package layer directly on the wafer by incorporating fabrication process. This new approach enhances the electrical properties and reduces the physical space making WLP an optimal package solution for mobile environments and high-density memory modules. <br /></p>