Samsung Develops Industry's Highest Capacity EEPROM-embedded Dual Interface Smart Card IC

Samsung Electronics Co., Ltd., the leader in advanced semiconductor technology, announced today that it has developed two dual interface smart card ICs ? product names S3CC9GC and S3CC9GW with 72kB and 144kB of embedded Electrically Erasable and Programmable ROM (EEPROMs) respectively. Samsung's new smart card ICs meets world-class smart card IC specifications for financial transactions and can store all types of personal and biological data that will eventually be required for electronic passports.

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<p><a href="http://www.physorg.com/news3874.html">Samsung Develops Industry's Highest Capacity EEPROM-embedded Dual Interface Smart Card IC</a></p> <p> Samsung Electronics Co., Ltd., the leader in advanced semiconductor technology, announced today that it has developed two dual interface smart card ICs ? product names S3CC9GC and S3CC9GW with 72kB and 144kB of embedded Electrically Erasable and Programmable ROM (EEPROMs) respectively. Samsung's new smart card ICs meets world-class smart card IC specifications for financial transactions and can store all types of personal and biological data that will eventually be required for electronic passports.</p>