Liquid cooling with microfluidic channels helps computer processors beat the heat

Integrated onto the backs of chips

A new technique for fabricating liquid cooling channels onto the backs of high-performance integrated circuits could allow denser packaging of chips while providing better temperature control and improved reliability.

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<p><a href="http://www.physorg.com/news4657.html">Liquid cooling with microfluidic channels helps computer processors beat the heat</a></p> <p> <b><i>Integrated onto the backs of chips</i></b> <br> <br>A new technique for fabricating liquid cooling channels onto the backs of high-performance integrated circuits could allow denser packaging of chips while providing better temperature control and improved reliability.</p>