Copper Resistivity Fixable for 45 nm Node, but Long-Term Issues Remain

Copper resistivity will remain a challenge for the semiconductor industry, but chip designers are likely to use hierarchical design workarounds to modify the metal for linewidths at the 45 nm technology node, according to participants at an industry workshop sponsored by SEMATECH and Novellus Systems, Inc.

If you want to include this story in your blog, copy and paste this formatted text: