IMEC concludes FEOL installation and enters into alliances for copper/low-k interconnect technology

IMEC successfully concludes installation of front-end-of-line (FEOL) tools with processing of first pathfinder lots. Strategic agreements with leading equipment manufacturers Applied Materials, Inc., ASM International and LAM Research Corporation have been extended to ramp up equipment installation for copper/low-k interconnect technology during the second half of 2005.

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<p><a href="http://www.physorg.com/news5076.html">IMEC concludes FEOL installation and enters into alliances for copper/low-k interconnect technology</a></p> <p>IMEC successfully concludes installation of front-end-of-line (FEOL) tools with processing of first pathfinder lots. Strategic agreements with leading equipment manufacturers Applied Materials, Inc., ASM International and LAM Research Corporation have been extended to ramp up equipment installation for copper/low-k interconnect technology during the second half of 2005.</p>