Intel Opens Leading-Edge 65nm, 300mm High-Volume Wafer Manufacturing Facility In Arizona

Intel Corporation has re-opened an advanced, high-volume semiconductor manufacturing facility in Chandler, Ariz., converting it to a leading-edge 300mm, 65nm process factory. Called Fab 12, the factory is Intel’s second volume-production fab using 65nm process technology produced on the industry’s largest wafer size (300mm), which provides the Intel fab with the potential to generate the world’s highest microprocessor output at the lowest cost.

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<p><a href="http://www.physorg.com/news7813.html">Intel Opens Leading-Edge 65nm, 300mm High-Volume Wafer Manufacturing Facility In Arizona</a></p> <p>Intel Corporation has re-opened an advanced, high-volume semiconductor manufacturing facility in Chandler, Ariz., converting it to a leading-edge 300mm, 65nm process factory. Called Fab 12, the factory is Intel’s second volume-production fab using 65nm process technology produced on the industry’s largest wafer size (300mm), which provides the Intel fab with the potential to generate the world’s highest microprocessor output at the lowest cost.</p>