Applied Materials Announces Advanced CVD Aluminum Technology

Applied Materials, Inc. today announced its Applied CVD Al process chamber for building current and next-generation high-density interconnects in Flash and DRAM memory chips. Using aluminum deposition technology, which continues to be the interconnect material of choice for memory applications, Applied's CVD Al chamber enables chipmakers to replace tungsten plugs with aluminum -- which has 50% lower electrical resistance -- while also reducing processing steps and cost.

If you want to include this story in your blog, copy and paste this formatted text:

<p><a href="http://www.physorg.com/news8798.html">Applied Materials Announces Advanced CVD Aluminum Technology</a></p> <p>Applied Materials, Inc. today announced its Applied CVD Al process chamber for building current and next-generation high-density interconnects in Flash and DRAM memory chips. Using aluminum deposition technology, which continues to be the interconnect material of choice for memory applications, Applied's CVD Al chamber enables chipmakers to replace tungsten plugs with aluminum -- which has 50% lower electrical resistance -- while also reducing processing steps and cost.</p>