New stamping process creates metallic interconnects, nanostructures

Creating high-resolution metallic interconnects is an essential part of the fabrication of microchips and other nanoscale devices. Researchers at the University of Illinois at Urbana-Champaign have developed a simple and robust electrochemical process for the direct patterning of metallic interconnects and other nanostructures.

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<p><a href="http://www.physorg.com/news91286833.html">New stamping process creates metallic interconnects, nanostructures</a></p> <p>Creating high-resolution metallic interconnects is an essential part of the fabrication of microchips and other nanoscale devices. Researchers at the University of Illinois at Urbana-Champaign have developed a simple and robust electrochemical process for the direct patterning of metallic interconnects and other nanostructures.</p>