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NanoPierce JV Scimaxx Solutions Announces Bumpless Flip Chip
NanoPierce Technologies, Inc. and Scimaxx Solutions LLC, a NanoPierce Joint Venture, announced the introduction of a new, proprietary flip chip process that does not require chips to be bumped.
“Bum
ping is the building up of material on chip bond pads to span the gap between the pads and the substrate and has been an essential part of flip chip technologies,” said Dr. Herbert Neuhaus, CEO of Scimaxx Solutions and Executive VP of NanoPierce Technologies. “We have demonstrated that hard, conductive particles can perform the function of the bumps with un-treated, un-bumped chips. Eliminating the need for bumping and any wafer-level or chip-level treatment lowers manufacturing cost and increases productivity without a negative impact on performance or reliability for many important applications.”
The bumpless flip chip process is an application of the patented NanoPierce Connection System owned by NanoPierce Technologies and licensed to the Scimaxx JV.
“We call our process PI3 because it is the third generation of the Particle Interconnect technology,” continued Dr. Neuhaus. “We have been focused on two key applications: RFID which need the simplest and fastest manufacturing process possible to meet cost targets; and specialized defense applications in which limited chip availability precludes the possibility of bumping. We are now selling this system in limited quantities for evaluation by industry leaders.”
Paul Metzinger, CEO of NanoPierce Technologies added “This important development is an ideal example of how NanoPierce continues to create shareholder value after the restructuring of last year. Although much leaner, NanoPierce and its JV partners have sustained the capability to serve the industry with radically new and highly competitive technical solutions.”
Find the original press release on http://www.nanopierce.com/
The bumpless flip chip process is an application of the patented NanoPierce Connection System owned by NanoPierce Technologies and licensed to the Scimaxx JV.
“We call our process PI3 because it is the third generation of the Particle Interconnect technology,” continued Dr. Neuhaus. “We have been focused on two key applications: RFID which need the simplest and fastest manufacturing process possible to meet cost targets; and specialized defense applications in which limited chip availability precludes the possibility of bumping. We are now selling this system in limited quantities for evaluation by industry leaders.”
Paul Metzinger, CEO of NanoPierce Technologies added “This important development is an ideal example of how NanoPierce continues to create shareholder value after the restructuring of last year. Although much leaner, NanoPierce and its JV partners have sustained the capability to serve the industry with radically new and highly competitive technical solutions.”
Find the original press release on http://www.nanopierce.com/
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