Altera Begins Shipping Industry's First High-Density 90-nm FPGAs to Customers

“We have received our first Stratix II devices, and look forward to incorporating them into our next-generation products,” said Roland Steffen, executive vice president, head of test and measurement division at Rohde and Schwarz. “Altera has done an impressive job of shipping their products on schedule, which was a critical factor in our decision to use the Stratix II family. The Stratix II architecture will enable us to achieve better performance, higher integration, and lower costs, while Altera’s clear commitment to on-time delivery will allow us to meet aggressive development and production schedules.”

Manufactured on 300-mm wafers using TSMC’s standard 90-nm process technology, which features Applied Materials’ Black Diamond® low-k dielectric, Stratix II devices were architected with an entirely new logic structure consisting of adaptive logic modules (ALMs). Altera designed the new architecture specifically for the 90-nm process to offer the highest possible performance and increased logic efficiency while managing the power consumption. Altera’s ability to ship parts to customers only four weeks after receiving first silicon from TSMC highlights the robustness of the process and is a good indication that the shipping schedule for the rest of the Stratix II family will be on target.

“The shipping of the EP2S60 is a major milestone in the programmable logic industry,” said Erik Cleage, Altera’s senior vice president of marketing. “Altera’s ability to ship high-density products to customers using state-of-the-art, 90-nm, low-k technology underscores Altera’s leadership in bringing innovative products to the market.”

Source: http://www.altera.com/