Applied Materials, IMEC Team to Develop Innovative 32nm, 22nm Interconnects

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IMEC
Applied Materials and IMEC, Europe's leading independent nanoelectronics and nanotechnology research center, announced today a significant joint effort to develop 32nm and 22nm-node copper/low k interconnect processing technologies using a suite of Applied Materials' most advanced systems. The goal of the joint program is to address critical manufacturing challenges that chipmakers may face as they transition to future device generations, helping them to bring new products to market more rapidly while minimizing risk.


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