IBM Pioneers Process to Turn Waste into Solar Energy

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IBM has developed a process for repurposing scrap silicon wafers from its chip manufacturing operations for use in energy-producing solar panels. In this photo Michelle Bolz an IBM manufacturing engineer holds a solar panel above a crate of scrap sil ...
IBM has developed a process for repurposing scrap silicon wafers from its chip manufacturing operations for use in energy-producing solar panels. In this photo Michelle Bolz, an IBM manufacturing engineer, holds a solar panel above a crate of scrap silicon wafers ready to be recycled. IBM intends to provide details of the new process to the broader semiconductor manufacturing industry.

IBM today announced an innovative new semiconductor wafer reclamation process pioneered at its Burlington, Vermont manufacturing facility. The new process uses a specialized pattern removal technique to repurpose scrap semiconductor wafers -- thin discs of silicon material used to imprint patterns that make finished semiconductor chips for computers, mobile phones, video games, and other consumer electronics -- to a form used to manufacture silicon-based solar panels.


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All News summaries for October 30, 2007

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