FEI Releases First-Ever DualBeam Photomask Repair System for 65 nm Node

Combined With FEI's SNP XT With Rapid CD(TM), Mask Makers Now Have an Open, Total Repair Solution for Next-generation Lithography Technologies

FEI Company (Nasdaq: FEIC) has released the industry's first-ever DualBeam(TM) mask repair system designed to repair photolithography mask defects for the 65 nm node. Combining both a focused ion beam (FIB) column and an environmental scanning electron microscope (ESEM(TM)) in a single system, the new Accura(TM) XT+ is a future-safe solution that can accommodate both today's photomasks and extend to a broad set of next-generation lithography technologies including EUV reflective, LEEPL/Stencil, Nanoimprint, CPL, and new absorber stacks.