Sandwich technique eases 3D optical chip fabrication

User rating: 5 / 5 after 3 vote(s)

Sandwich technique eases 3D optical chip fabrication
Complex three-dimensional (3D) integrated circuits involving both optical and electronic elements are now easier to make, thanks to a “wafer bonding” technique developed by a European research consortium. With the right commercial backing, the new technology will help Europe stay competitive in communications and sensor technology.


Full story »

All News summaries from Technology news
All News summaries for November 29, 2007

China's mobile users top 600 million: govt

2 hours ago | User rating: not rated yet
The number of mobile users in China, the world's biggest cellphone market, now tops 600 million, the government said, as subscribers increasingly abandon fixed lines.

Amazon shares leap on strong quarterly report

2 hours ago | User rating: not rated yet
(AP) -- Amazon.com Inc. shares leaped 13 percent Thursday after the Internet retailer showed that it doesn't seem to be bothered by the sputtering U.S. economy.

Embarq provides more details on Web tracking test

2 hours ago | User rating: not rated yet
(AP) -- Embarq Corp. has revealed more details about its exploration of a program that tracked Internet subscribers' Web-surfing habits for advertising purposes, telling Congress that it performed the test on 26,000 customers ...

Qualcomm earns outlook falls short of expectations

2 hours ago | User rating: not rated yet
(AP) -- Qualcomm, the world's largest maker of chips that run cell phones, issued fourth-quarter and full-year earnings guidance Thursday that fell short of Wall Street targets, but the stock soared on a broad-ranging legal ...

Taiwan's AU Optronics posts lower-than-expected profit

8 hours ago | User rating: not rated yet
Taiwan's AU Optronics Corp., the world's third-largest flat-panel maker by revenue, said Thursday its second-quarter net profit fell 24.4 percent from the previous quarter due to weak global demand.