New paper reveals nanoscale details of photolithography process

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Schematic of the photolithography process shows the formation of a gradient extending from the photoresist material to be removed (center) into the unexposed portions of the resist on the sides. NIST measurements document the residual swelling fracti ...
Schematic of the photolithography process shows the formation of a gradient extending from the photoresist material to be removed (center) into the unexposed portions of the resist on the sides. NIST measurements document the residual swelling fraction caused by the developer that can contribute to roughness in the final developed image. Credit: NIST
Scientists at the National Institute of Standards and Technology have made the first direct measurements of the infinitesimal expansion and collapse of thin polymer films used in the manufacture of advanced semiconductor devices. It’s a matter of only a couple of nanometers, but it can be enough to affect the performance of next-generation chip manufacturing. The NIST measurements, detailed in a new paper, offer a new insight into the complex chemistry that enables the mass production of powerful new integrated circuits.


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