'Hybrid' semiconductors show zero thermal expansion, could lead to hardier electronics and optoelectronics

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The crystal structure of -ZnTe(en)0:5 determined by single-crystal X-ray diffraction. Two-monolayerthick ZnTe slabs are interconnected by ethylenediamine (C2N2H8) molecules bonded to zinc atoms. Zn-Green Te-Red N-Blueand C-Gray. Hydrogen atoms are om ...
The crystal structure of -ZnTe(en)0:5, determined by single-crystal X-ray diffraction. Two-monolayerthick ZnTe slabs are interconnected by ethylenediamine (C2N2H8) molecules bonded to zinc atoms. Zn-Green, Te-Red, N-Blue,and C-Gray. Hydrogen atoms are omitted for clarity. Credit: ANL

The fan in your computer is there to keep the microprocessor chip from heating to the point where its component materials start to expand, inducing cracks that interrupt the flow of electricity — and not incidentally, ruin the chip. Thermal expansion can also separate semiconducting materials from the substrate, reduce performance through changes in the electronic structure of the material or warp the delicate structures that emit laser light.


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All News summaries for December 19, 2007

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