New polymer could improve semiconductor manufacturing, packaging

Researchers from Rensselaer Polytechnic Institute's Department of Physics and Center for Integrated Electronics have developed a new inexpensive, quick-drying polymer that could lead to dramatic cost savings and efficiency gains in semiconductor manufacturing and computer chip packaging. In this scanning electron microscope image of the new PES polymer in a photolithography application, the straight side walls indicate the material's good photodefinition characteristics. Credit: Rensselaer Polytechnic Institute