Elpida Memory Develops 90 nm Silicon Wafer Process for High-Performance DDR2 SDRAM

Advanced Process Technology Boosts Production Efficiency for Superior DDR2 Products

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that is has developed its new 90 nm production process for high-performance DRAM products. 90 nm (or 0.09 micron) is the next-generation measurement for silicon wafer manufacturing, following 100 nm (or 0.10 micron). It will allow more silicon chips to be produced on a single wafer because the size of each chip is smaller, and it improves overall production efficiency. Elpida's 90 nm process technology will first be applied to the production of high-performance 512 Megabit and 1 Gigabit DDR2 SDRAM products starting next year.