IMEC breakthrough shrinks wireless bioelectronic communications system into a 1 cm³ system-in-a-cube
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IMEC has developed a miniature 1 cm³ 3-dimensional stacked system-in-a-cube (SiC) for wireless bioelectronic communications systems. The low-power 3D SiC, which comprises a radio and digital signal processing (DSP), has broad application in a variety of wireless products, ranging from monitors for human-body information to environmental data. The bioelectronics breakthrough will be first incorporated into a wearable, wireless electroencephalogram (EEG) developed by IMEC and the University Hospital Leuven, Belgium, last year. Using the 3D SiC, patients can wear a comfortable device and maintain maximum mobility during the electroencephalogram, eliminating the hospital stay traditionally required for this procedure.
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