TSMC Qualifies Applied Materials' Gate Stack System for Its Leading-Edge 65nm Transistor Processes

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Applied Materials, Inc. announced today that Taiwan Semiconductor Manufacturing Co. (TSMC) has qualified the Applied Centura Gate Stack system with DPN (decoupled plasma nitridation) technology for all of its 65nm-generation transistor fabrication processes. This advanced technology enabled TSMC to achieve their 65nm equivalent oxide thickness (EOT) scaling targets while increasing device speed.


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