IMEC shows progress in lead-free materials at IMAPS EMPC 2005

IMEC announces advances in identification of lead-free (Pb-free) solder materials in four papers at the 2005 IMAPS European Microelectronics and Packaging Conference (EMPC). Progress is reported in the understanding of the thermomechanical and electromigration behavior of various Pb-free alloys for flip-chip and chip-sized package (CSP)/ball-grid array (BGA) applications. In fine-pitch applications, Co as an alternative to Cu for under-bump metallurgy was found to significantly improve the solder fatigue life. The results largely contribute to the selection of the best Pb-free composition and component finish in microelectronics applications which is imposed by the EU directive to introduce Pb-free soldering in the EU by July 1, 2006.