Applied Materials Launches Black Diamond II Low k Solution for Next Generation High-Speed Chips
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Applied Materials, Inc., the worldwide market leader in low k dielectric film technology, today announced its new Applied Producer Black Diamond II system for depositing the semiconductor industry's most advanced low k film. Providing a k-value of less than 2.5, the Black Diamond II system utilizes Applied's innovative NanoCure UV curing technology to achieve a robust, manufacturable film compatible with CMP and packaging processes.
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