Future Computer Chips Could Be Cooled With Nanofluid

“This is the next generation of cooling devices,” Dr. Hongbin Ma tells PhysOrg.com. With a group of students at the University of Missouri-Columbia, and colleagues at Argonne National Laboratory and Intel Corporation, Ma presents the findings of a unique cooling device that makes use of an Oscillating Heat Pipe (OHP) and nanofluids. The findings, published online at Applied Physics Letters on April 5^th, present a breakthrough that will provide a way for cooling technology to keep pace with developments in electronic technology.