Philips ramps 90-nm CMOS products into high-volume and test-chips process options

Royal Philips Electronics today announced that it has ramped three key 90-nm CMOS products into volume production at the Crolles2 Alliance wafer fab in Crolles, France. The three Philips products, one of which is already shipping at more than 1 million pieces per month, are baseband chips for highly integrated System-in-Package (SiP) connectivity solutions, demonstrating the power of 90-nm CMOS to reduce the size and power consumption of these solutions and keep them on highly competitive price curves.