Samsung Develops New, Highly Efficient Stacking Process for DRAM

User rating: 4.6 / 5 after 8 vote(s)

Samsung Electronics today announced that it has developed the first all-DRAM stacked memory package using ‘through silicon via’ (TSV) technology, which will soon result in memory packages that are faster, smaller and consume less power.

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All News summaries for April 23, 2007

Sony opens up e-book Reader to other booksellers

Jul 24, 2008 | User rating: not rated yet

(AP) -- With the market for electronic books still relatively sleepy, Sony Corp. is trying a new tack: untethering the latest model of its e-book reading device from its own online bookstore.

Graphics processing installation to boost Argonne's Blue Gene/P visualization capabilities

Jul 23, 2008 | User rating: not rated yet

(PhysOrg.com) -- The IBM Blue Gene/P Intrepid at the Argonne Leadership Computing Facility (ALCF), located at the U.S. Department of Energy's (DOE) Argonne National Laboratory, will soon have the data analytics ...

Analysis finds TV buyers steered to costlier LCDs

Jul 21, 2008 | User rating: not rated yet

(AP) -- LCD or plasma? If you've been shopping for a flat-panel TV, that's the big question. According to a mystery-shopper survey, electronics salespeople don't know much about the differences, but still have a ready answer: ...

Make way Ronaldo, here come the robots

Jul 18, 2008 | User rating: not rated yet

After Euro 2008, now Austria is preparing to host RoboCup, where 500 robots take to the football field hoping to prove their mettle.

iPhones hot even in places Apple has yet to reach

Jul 18, 2008 | User rating: not rated yet

(AP) -- In the Soviet days, Russians asked their American friends to bring blue jeans, rock records and other Western goods into the country. Today Russians can buy almost anything they want here - but they ...

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