Fujitsu Develops Technology for Low-Power, High-Performance 45nm Logic Chips

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Cross-section of 9Cu 1Al interconnect module with Full-NCS at lower Cu layers developed by Fujitsu
Cross-section of 9Cu + 1Al interconnect module with Full-NCS at lower Cu layers, developed by Fujitsu

Fujitsu today announced the development of a platform technology for 45 nanometer generation LSI logic chips, which combines technologies for low power consumption and high-performance interconnect.


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