KlA-Tencor Unveiled Atomic Force Line Monitoring Solution For 90-/65-nm IC Production

KLA-Tencor unveiled the AF-LM 300—the first true line monitoring solution for trench depth and surface planarity process control based on atomic force microscopy (AFM). Until now, traditional AFMs have lacked the throughput and reliability needed for many inline process monitoring applications. Delivering high reliability, unmatched ease of use and significantly increased throughput compared to traditional AFMs, the AF-LM 300 enables chipmakers to support up to 100 percent lot sampling on the production floor at the 90-nm and 65-nm nodes—providing tighter process monitoring, which in turn helps chipmakers produce better performing and higher yielding devices. Leading IC manufacturers like Infineon Technologies have installed the AF-LM 300 in their advanced fabs for evaluation, and KLA-Tencor has received multiple orders for the new system.