KLA-Tencor Speeds Yield Learning and Enables Baseline Yield Improvement with Automated Spatial Signature Analysis

KLA-Tencor (NASDAQ: KLAC) today introduced Klarity SSA (Spatial Signature Analysis), a new software capability that enhances the company's suite of defect management systems by providing automated classification and root cause analysis of spatial signatures, which are defect clusters and patterns that can be indicative of an out-of-spec process or process tool problem. Klarity SSA imports wafer-map data generated by wafer inspection tools, and then characterizes and groups defect clusters by their identifiable signatures automatically. With Klarity SSA incorporated into their fab-wide process control strategies, defect and yield engineers can gain greater insight into their manufacturing processes--accelerating their yield learning and improving baseline yields. Klarity SSA can be utilized for a variety of applications where enhanced excursion detection is needed, including process line and tool monitoring, as well as engineering analysis, across all key process modules.