Elpida Memory's 512 Megabit Mobile RAM Device Fits in Smaller Package for 3G Phones

90 nm Process Technology Enables Smaller Die Size, Easier Implementation in Multi-Chip-Package and System-in-Package Designs

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it has started shipping samples of small form-factor, 512 Megabit Mobile RAM devices for high-performance, 3G cellular applications. By utilizing 90 nm process technology, Elpida can now offer customers 512 Megabit Mobile RAM devices with a smaller and square die for easier implementation into Multi-Chip Package (MCP) and System-in-Package (SiP) designs which require 11 x 11 mm packages or smaller to save valuable board space.