http://www.physorg.com/ en-us Physorg.com internet news portal provides the latest news on science including: Physics, Nanotechnology, Life Sciences, Space Science, Earth Science, Environment, Health and Medicine. At today`s IEEE International Electron Devices Meeting, IMEC reports significant progress in improving the performance of planar CMOS using hafnium-based high-k dielectrics and tantalum-carbide metal gates targeting the 32nm CMOS node. http://www.physorg.com/news116612153.html Technology Tue, 11 Dec 2007 16:15:53 EST news116612153 Although approved by the U.S. Food and Drug Administration as a palliative treatment for cancer patients who have developed bile-duct obstructions, biliary stents are sometimes used `off-label` for the treatment of peripheral vascular disease (PVD). A study in today`s issue of the American Journal of Therapeutics finds that off-label use of biliary stents is increasing, and that the majority of adverse events and device malfunctions associated with the use of these stents occurs during off-label usage. http://www.physorg.com/news120108468.html Medicine & Health Mon, 21 Jan 2008 03:27:48 EST news120108468 New sputter source represents break through in target efficiency - provides significant cost savings to chip manufacturersTegal Corporation announced that it has been granted United States Patent, No. 6,783,638 for the Flat Magnetron sputter source. The invention provides for the use of a greater percentage of the material from the sputter target than in existing conventional physical vapor deposition ("PVD") systems. Direct benefits of the novel design include lowering material cost, enhancing sputtering rate, and increasing deposition system availability. System uptime and availability is a key variable in semiconductor chip manufacturers' actual cost of system ownership. http://www.physorg.com/news2455.html Technology Mon, 20 Dec 2004 14:38:18 EST news2455 Applied Materials, Inc. today introduced the Applied Endura CuBS II, a breakthrough system that enables PVD copper barrier/seed deposition at 45nm and beyond. The system's new SIP EnCoRe II process chambers feature novel, high power density sputtering sources that create extremely dense, CVD-like conformal films for thin tantalum barrier and copper seed layers with minimal overhang, even at the bottom of very deep, small via holes. Also, sputtering target lifetime has been doubled to more than 20,000 wafers, significantly reducing cost of ownership and maintenance requirements. http://www.physorg.com/news2198.html Nanotechnology Sat, 04 Dec 2004 10:30:56 EST news2198 The industry`s first development of 70-nanometer DRAM process technology employing the CVD methodSamsung Electronics announced that it has developed the industry`s first `CVD aluminum` process technology, the very latest 70-nanometer node DRAM process technology employing the Chemical Vapor Deposition or CVD method. http://www.physorg.com/news125.html Technology Fri, 28 May 2004 14:14:03 EST news125 Applied Materials, Inc. today announced a key advancement in nano-scale interface engineering with its new Applied Siconi Preclean process for fabricating leading-edge transistor contacts. http://www.physorg.com/news6628.html Technology Tue, 20 Sep 2005 15:15:44 EST news6628 Applied Materials, Inc. today announced its Applied CVD Al process chamber for building current and next-generation high-density interconnects in Flash and DRAM memory chips. Using aluminum deposition technology, which continues to be the interconnect material of choice for memory applications, Applied's CVD Al chamber enables chipmakers to replace tungsten plugs with aluminum -- which has 50% lower electrical resistance -- while also reducing processing steps and cost. http://www.physorg.com/news8798.html Technology Tue, 06 Dec 2005 14:51:10 EST news8798 Applied Materials and IMEC, Europe's leading independent nanoelectronics and nanotechnology research center, announced today a significant joint effort to develop 32nm and 22nm-node copper/low k interconnect processing technologies using a suite of Applied Materials' most advanced systems. The goal of the joint program is to address critical manufacturing challenges that chipmakers may face as they transition to future device generations, helping them to bring new products to market more rapidly while minimizing risk. http://www.physorg.com/news10188.html Nanotechnology Tue, 24 Jan 2006 14:13:20 EST news10188 Soaring air conditioning bills or suffering in the sweltering heat could soon be a thing of the past, thanks to UCL chemists.Reporting in the Journal of Materials Chemistry, researchers reveal they have developed an intelligent window coating that, when applied to the glass of buildings or cars, reflects the sun`s heat so you don`t get too hot under the collar. http://www.physorg.com/news754.html Physics Tue, 10 Aug 2004 03:51:11 EST news754 Applied Materials, Inc. received orders from Advanced Micro Devices, Inc. (AMD) for 300mm equipment to manufacture its future advanced 65nm-generation 64-bit microprocessors. The orders cover a broad range of process technologies, including Applied's most advanced etch systems, as well as a comprehensive suite of metrology and inspection tools. The systems are scheduled to begin shipping to AMD's new 300mm Fab 36 in Dresden, Germany, in late calendar 2004. http://www.physorg.com/news2401.html Technology Thu, 16 Dec 2004 13:13:06 EST news2401 STMicroelectronics, one of the world's leading suppliers of semiconductor devices, will participate as presenter or co-author in fifteen papers at the IEDM 2004 (International Electron Devices Meeting) Conference, which takes place during December 13-15 in San Francisco, California. Eleven papers originating from Crolles, France, cover developments in leading-edge CMOS technology, while four are devoted to advances in Non-Volatile Memory technology developed at ST's Central R&D facility in Agrate, Italy. http://www.physorg.com/news2325.html Technology Fri, 10 Dec 2004 14:08:35 EST news2325