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     <title>Toshiba develops cost-effective 32nm CMOS platform technology by advanced single exposure lithography</title>
   	 <description>Toshiba Corporation today announced a cost-effective 32nm CMOS platform technology that offers higher density and improved performance while halving the cost per function from 45nm technology.</description>
     <link>http://www.physorg.com/news148843305.html</link>
	 <category>Technology</category>
	 <pubDate>Thu, 18 Dec 2008 17:21:45 EST</pubDate>
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     <title>AMD, Partners Produce Test Chip Using EUV Lithography</title>
   	 <description>AMD, working together with its research partner, IBM, announced it has produced a working test chip utilizing Extreme Ultra-Violet (EUV) lithography for the critical first layer of metal connections across the entire chip. </description>
     <link>http://www.physorg.com/news123256413.html</link>
	 <category>Technology</category>
	 <pubDate>Tue, 26 Feb 2008 13:53:33 EST</pubDate>
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     <title>ASML, Zeiss and Canon Cross-license Lithography Equipment Patent Portfolios</title>
   	 <description>ASML Holding NV and Carl Zeiss SMT today announce that each has signed an agreement with Canon for the global cross-license of patents in their respective fields of semiconductor lithography and optical components, used to manufacture integrated circuits, or chips.</description>
     <link>http://www.physorg.com/news117465405.html</link>
	 <category>Technology</category>
	 <pubDate>Fri, 21 Dec 2007 13:16:45 EST</pubDate>
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     <title>TI developes 45-nm chip production process</title>
   	 <description>Texas Instruments said Monday it had developed a 45-nanometer wet lithography process that doubles the number of chips it can produce on a silicon wafer. </description>
     <link>http://www.physorg.com/news69337824.html</link>
	 <category>Technology</category>
	 <pubDate>Mon, 12 Jun 2006 13:30:24 EST</pubDate>
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     <title>Toshiba develops molecular photoresist technology for EUV lithography </title>
   	 <description>Toshiba Corporation today announced that it has developed a high resolution photoresist (photo-sensitive film) essential for future application of EUV (extreme ultraviolet) lithography in semiconductor fabrication, and proved its viability with the world's first 20nm-scale generation process technology.</description>
     <link>http://www.physorg.com/news177697613.html</link>
	 <category>Technology</category>
	 <pubDate>Tue, 17 Nov 2009 16:27:55 EST</pubDate>
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     <title>Breakthrough Computer Chip Lithography Method Developed at RIT</title>
   	 <description>A new computer chip lithography method under development at Rochester Institute of Technology has led to imaging capabilities beyond that previously thought possible.</description>
     <link>http://www.physorg.com/news10755.html</link>
	 <category>Technology</category>
	 <pubDate>Fri, 10 Feb 2006 11:38:19 EST</pubDate>
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     <title>IMEC demonstrates feasibility of double patterning immersion litho for 32nm node</title>
   	 <description>IMEC showed in collaboration with ASML the potential of double patterning 193nm immersion lithography at 1.2NA for 32nm node Flash and logic.</description>
     <link>http://www.physorg.com/news80410095.html</link>
	 <category>Technology</category>
	 <pubDate>Wed, 18 Oct 2006 17:08:15 EST</pubDate>
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     <title>IMEC reports major progress in EUV</title>
   	 <description>IMEC reports functional 0.186µm2 32nm SRAM cells made with FinFETs from which the contact layer was successfully printed using ASML`s full field extreme ultraviolet (EUV) Alpha Demo Tool (ADT). Applied Materials, using its most advanced deposition systems, was key to fabricating the ultra-small circuit structures. IMEC also completed the integration and site acceptance test of the EUV ADT in its 300mm clean room. </description>
     <link>http://www.physorg.com/news135270280.html</link>
	 <category>Technology</category>
	 <pubDate>Mon, 14 Jul 2008 16:04:40 EST</pubDate>
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     <title>Making a good impression: Nanoimprint lithography tests at NIST</title>
   	 <description>In what should be good news for integrated circuit manufacturers, recent studies by the National Institute of Standards and Technology have helped resolve two important questions about an emerging microcircuit manufacturing technology called nanoimprint lithography -yes, it can accurately stamp delicate insulating structures on advanced microchips, and, no, it doesn`t damage them, in fact it makes them better.</description>
     <link>http://www.physorg.com/news128707959.html</link>
	 <category>Nanotechnology</category>
	 <pubDate>Tue, 29 Apr 2008 17:12:39 EST</pubDate>
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     <title>Researchers report finer lines for microchips: Advance could lead to next-generation computer chips, solar cells</title>
   	 <description>MIT researchers have achieved a significant advance in nanoscale lithographic technology, used in the manufacture of computer chips and other electronic devices, to make finer patterns of lines over larger areas than have been possible with other methods.</description>
     <link>http://www.physorg.com/news134743399.html</link>
	 <category>Nanotechnology</category>
	 <pubDate>Tue, 08 Jul 2008 13:43:19 EST</pubDate>
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     <title>Researchers Create Enhanced Light Sources For Lithography</title>
   	 <description>A breakthrough discovery at UC San Diego may help aid the semiconductor industry`s quest to squeeze more information on chips to accelerate the performance of electronic devices. So far, the semiconductor industry has been successful in its consistent efforts to reduce feature size on a chip.  Smaller features mean denser packing of transistors, which leads to more powerful computers, more memory, and hopefully lower costs.</description>
     <link>http://www.physorg.com/news134839193.html</link>
	 <category>Technology</category>
	 <pubDate>Wed, 09 Jul 2008 16:19:53 EST</pubDate>
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     <title>New microfabrication technology announced</title>
   	 <description>U.S. scientists have created a new method of rapidly engineering complex micro-scale patterns and 3D microstructures from biocompatible proteins. </description>
     <link>http://www.physorg.com/news90169892.html</link>
	 <category>Chemistry</category>
	 <pubDate>Thu, 08 Feb 2007 15:11:32 EST</pubDate>
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     <title>SEMATECH Achieves Single Digit EUV Mask Blank Defect Goal</title>
   	 <description>Technologists at SEMATECH have successfully demonstrated world-class results in low defect density for mask blanks used in extreme ultraviolet lithography (EUVL) -pushing the technology another significant step toward readiness for advanced manufacturing. </description>
     <link>http://www.physorg.com/news121963804.html</link>
	 <category>Technology</category>
	 <pubDate>Mon, 11 Feb 2008 14:50:04 EST</pubDate>
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     <title>New polymer could improve semiconductor manufacturing, packaging</title>
   	 <description>Researchers at Rensselaer Polytechnic Institute and Polyset Company have developed a new inexpensive, quick-drying polymer that could lead to dramatic cost savings and efficiency gains in semiconductor manufacturing and computer chip packaging.</description>
     <link>http://www.physorg.com/news120756427.html</link>
	 <category>Nanotechnology</category>
	 <pubDate>Mon, 28 Jan 2008 15:27:07 EST</pubDate>
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     <title>Fabricating 3D Photonic Crystals</title>
   	 <description>(PhysOrg.com) -- `In photonic crystals, the ability to control the structure of a material in full three dimensional space, allows you to control the way that light flows through it,` John Rogers tells PhysOrg.com. `This approach to photonic materials can be useful in applications ranging from communications to lasers to optical waveguides.`</description>
     <link>http://www.physorg.com/news151758574.html</link>
	 <category>Physics</category>
	 <pubDate>Wed, 21 Jan 2009 11:10:25 EST</pubDate>
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