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     <title>NEC Develops a Three-Dimensional Chip-Stacked Flexible Memory</title>
   	 <description>NEC Corporation announced today the development of chip-stacked flexible memory, which can be used to achieve a new system-on-chip (SoC) architecture. The new SoC's architecture consists of separate logic (excluding embedded memory cores) and memory chips (chip-stacked flexible memory) that are closely stacked by using a three-dimensional packaging technology.</description>
     <link>http://www.physorg.com/news153510219.html</link>
	 <category>Technology</category>
	 <pubDate>Tue, 10 Feb 2009 17:44:32 EST</pubDate>
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     <title>Samsung Introduces Software to Increase Efficiency of Embedded Memory Solutions for Smart Phones</title>
   	 <description>Samsung Electronics, the world leader in advanced semiconductor technology, announced today that it is introducing software designed to optimize the high performance features of its proprietary embedded flash memories: OneNAND, Flex-OneNAND and moviNAND, in smart phones, using the major mobile operating systems  - Windows Mobile(CE), Symbian, Linux, and RTOS (real-time operating system).</description>
     <link>http://www.physorg.com/news137855949.html</link>
	 <category>Electronics</category>
	 <pubDate>Wed, 13 Aug 2008 14:19:09 EST</pubDate>
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     <title>Toshiba Launches the Largest Density Embedded NAND Flash Memory Devices</title>
   	 <description>Toshiba Corporation today announced the launch of 32GB embedded NAND flash memory modules that offer the largest density yet announced plus full compliance with the e-MMC and eSD standards. The embedded devices are designed for application in mobile digital consumer products, including mobile phones and video cameras. Samples will be available in September 2008, and mass production will start in the fourth quarter.</description>
     <link>http://www.physorg.com/news137340847.html</link>
	 <category>Electronics</category>
	 <pubDate>Thu, 07 Aug 2008 15:14:07 EST</pubDate>
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