<?xml version="1.0" encoding="iso-8859-1"?>
<?xml-stylesheet type="text/xsl" href="http://www.physorg.com/tmpl/default/css/default/feedRSS.xsl"?>
<rss version="2.0">
<channel>
<title>PHYSorg.com: Semiconductors News</title>
<link>http://www.physorg.com/technology-news/semiconductors/</link>
<language>en-us</language> 
<description>PhysOrg.com provides the latest news on semiconductor technology, semiconductor sciences and semiconductors. </description>

 <item>
     <title>New 'finFETs' promising for smaller transistors, more powerful chips</title>
   	 <description>(PhysOrg.com) -- Purdue University researchers are making progress in developing a new type of transistor that uses a finlike structure instead of the conventional flat design, possibly enabling engineers to create faster and more compact circuits and computer chips.</description>
     <link>http://www.physorg.com/news177088957.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Tue, 10 Nov 2009 15:24:39 EST</pubDate>
	 <guid isPermaLink="false">news177088957</guid>
</item>
<item>
     <title>Samsung Develops Advanced Packaging Technology to Achieve a 0.6mm-thick 8-chip Package</title>
   	 <description>Samsung Electronics announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory package is just half the thickness of a conventional memory package of eight stacked chips (or dies). The advanced packaging technology delivers a 40 percent thinner and lighter memory solution for high-density multimedia handsets and mobile devices.</description>
     <link>http://www.physorg.com/news176651546.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Thu, 05 Nov 2009 13:53:06 EST</pubDate>
	 <guid isPermaLink="false">news176651546</guid>
</item>
<item>
     <title>NXP Sets New Benchmarks for LED Drivers</title>
   	 <description>NXP Semiconductors today announced three major developments in its portfolio of mains connected LED driver solutions: the success of its SSL2101 LED driver IC in matching LED lifetimes in an accelerated lifetime test; the introduction of the SSL 2102 integrated dimmable mains LED driver IC for SSL retrofit lamps and modules; and the launch of its online design tool for SSL applications, which makes it easy for engineers to test the behavior of LED lighting applications based on four NXP products.</description>
     <link>http://www.physorg.com/news176624365.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Thu, 05 Nov 2009 06:30:02 EST</pubDate>
	 <guid isPermaLink="false">news176624365</guid>
</item>
<item>
     <title>Intel Reports Breakthrough in Stacked, Cross Point Phase Change Memory Technology</title>
   	 <description>Intel Corp. and Numonyx today announced a key breakthrough in the research of phase change memory (PCM), a new non-volatile memory technology that combines many of the benefits of today's various memory types.</description>
     <link>http://www.physorg.com/news176064260.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Thu, 29 Oct 2009 20:09:31 EST</pubDate>
	 <guid isPermaLink="false">news176064260</guid>
</item>
<item>
     <title>STMicroelectronics and ARM Team Up to Power Next-Generation Home Entertainment</title>
   	 <description>STMicroelectronics, one of the world`s leading set-top-box chip makers, and ARM, announced today that ST has adopted the ARM Cortex-A9 MPCore processor, in addition to the Mali-400  graphics processor, for its upcoming set-top-box and digital TV system-on-chip (SoC) ICs.</description>
     <link>http://www.physorg.com/news175953537.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Wed, 28 Oct 2009 13:20:01 EST</pubDate>
	 <guid isPermaLink="false">news175953537</guid>
</item>
<item>
     <title>SEMATECH Reports New Approach to Simulate Transistor Noise</title>
   	 <description>Researchers from SEMATECH's Front End Processes (FEP) program have developed a comprehensive transistor noise model capable of extracting defect characteristics from low frequency noise data in advanced gate stack transistors using both conventional and novel dielectrics. The proposed model is a key step towards identifying and minimizing defects to support aggressive device scaling. SEMATECH`s results were presented at the IEEE Integrated Reliability Workshop (IRW) on Thursday, October 22, in Lake Tahoe, CA. </description>
     <link>http://www.physorg.com/news175882600.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Tue, 27 Oct 2009 17:40:01 EST</pubDate>
	 <guid isPermaLink="false">news175882600</guid>
</item>
<item>
     <title>ARM Introduces New Cortex-A5 Power-Efficient and Cost-Effective Multicore Processor</title>
   	 <description>(PhysOrg.com) -- ARM today announces the launch of the ARM Cortex-A5 MPCore processor, the smallest, lowest power ARM multicore processor capable of delivering the Internet to the widest possible range of devices, from ultra low cost handsets, feature phones and smart mobile devices, to pervasive embedded, consumer and industrial devices.</description>
     <link>http://www.physorg.com/news175358395.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Wed, 21 Oct 2009 16:10:01 EST</pubDate>
	 <guid isPermaLink="false">news175358395</guid>
</item>
<item>
     <title>Silicon Image Introduces New 18 MegaPixel Camera Processor IP Core</title>
   	 <description>Silicon Image today introduced the camerIC-18, the newest member of its family of camerIC camera processor IP cores.</description>
     <link>http://www.physorg.com/news174590335.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Mon, 12 Oct 2009 18:30:01 EST</pubDate>
	 <guid isPermaLink="false">news174590335</guid>
</item>
<item>
     <title>ARM Announces 45nm SOI Test Chip Results That Demonstrate 40 Percent Power Savings Over Bulk Process</title>
   	 <description>ARM announced at the IEEE SOI Conference, Foster City, Calif., the results from a silicon-on-insulator (SOI) 45nm test chip that demonstrate potential power savings of up to 40 percent over traditional bulk process for manufacturing chips. The test chip was based on an ARM 1176 processor and enables a direct comparison between SOI and bulk microprocessor implementations. The results confirm SOI technology is a viable alternative to traditional bulk process technology when designing low-power processors for high-performance consumer devices and mobile applications. </description>
     <link>http://www.physorg.com/news174221285.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Thu, 08 Oct 2009 12:50:01 EST</pubDate>
	 <guid isPermaLink="false">news174221285</guid>
</item>
<item>
     <title>Cooperative design shaves chip-making costs -- a boost for Europe's bottom line</title>
   	 <description>(PhysOrg.com) -- A European-sponsored programme that gives universities inexpensive access to state-of-the-art microchip design tools and fabrication techniques, and helps even small businesses fabricate novel microchips, is helping Europe remain competitive worldwide.   </description>
     <link>http://www.physorg.com/news174062633.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Tue, 06 Oct 2009 16:00:02 EST</pubDate>
	 <guid isPermaLink="false">news174062633</guid>
</item>
<item>
     <title>Filming photons, one million times a second</title>
   	 <description>(PhysOrg.com) -- European researchers have created a CMOS (semiconductor) camera capable of filming individual photons one million times a second. The breakthrough will impact on all the most advanced areas of science and makes Europe the world leader in the technology.</description>
     <link>http://www.physorg.com/news173957578.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Mon, 05 Oct 2009 10:39:01 EST</pubDate>
	 <guid isPermaLink="false">news173957578</guid>
</item>
<item>
     <title>Fujitsu Develops Millimeter-Wave Gallium-Nitride Transceiver Amplifier Chipset</title>
   	 <description>Fujitsu announced today the development of the world's first gallium-nitride HEMT-based transceiver amplifier chipset for broadband wireless transmission equipment operating in the millimeter bandwidth, the range of 70 to 100 GHz, for which widespread usage is expected to grow. The new transceiver amplifier chipset features a GaN HEMT-based high-output transmitter amplifier and high-sensitivity receiver amplifier.</description>
     <link>http://www.physorg.com/news173555471.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Wed, 30 Sep 2009 19:40:01 EST</pubDate>
	 <guid isPermaLink="false">news173555471</guid>
</item>
<item>
     <title>Elpida Unveils Industry's First 2-Gigabit DDR2 Mobile RAM</title>
   	 <description>Elpida Memory, Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had developed the industry's first 2-gigabit DDR2 Mobile RAM.</description>
     <link>http://www.physorg.com/news173430536.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Tue, 29 Sep 2009 10:10:01 EST</pubDate>
	 <guid isPermaLink="false">news173430536</guid>
</item>
<item>
     <title>Moore's Law Marches on at Intel</title>
   	 <description>Intel President and CEO Paul Otellini today displayed a silicon wafer containing the world's first working chips built on 22nm process technology. The 22nm test circuits include both SRAM memory as well as logic circuits to be used in future Intel microprocessors.</description>
     <link>http://www.physorg.com/news172852816.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Tue, 22 Sep 2009 16:10:01 EST</pubDate>
	 <guid isPermaLink="false">news172852816</guid>
</item>
<item>
     <title>IMEC unveils promising mechanically-stacked GaAs/Ge multijunction solar cell</title>
   	 <description>At the European Photovoltaic Solar Energy Conference (Hamburg, Germany), IMEC presents a mechanically-stacked GaAs/Ge multijunction solar cell. This is the first promising demonstrator of IMEC`s novel technology to produce mechanically stacked, high-efficiency multijunction solar cells, aiming at efficiencies above 40%.</description>
     <link>http://www.physorg.com/news172821370.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Tue, 22 Sep 2009 07:50:01 EST</pubDate>
	 <guid isPermaLink="false">news172821370</guid>
</item>
<item>
     <title>IMEC presents large area solar cells with 18.4% conversion efficiency, featuring Cu-plated contacts </title>
   	 <description>At the European Photovoltaic Solar Energy Conference (Hamburg, Germany), IMEC presents a large-area solar with a conversion efficiency of 18.4%.</description>
     <link>http://www.physorg.com/news172821225.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Tue, 22 Sep 2009 06:56:37 EST</pubDate>
	 <guid isPermaLink="false">news172821225</guid>
</item>
<item>
     <title>Sharp's New Semiconductor Laser for Triple- and Quadruple- Layer Blu-ray Discs</title>
   	 <description>(PhysOrg.com) -- Sharp Corporation has announced the development of a new 500 mW semiconductor laser for triple- and quadruple- layer Blu-ray discs.</description>
     <link>http://www.physorg.com/news172481493.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Fri, 18 Sep 2009 10:10:01 EST</pubDate>
	 <guid isPermaLink="false">news172481493</guid>
</item>
<item>
     <title>Two chips in one: Researchers combine microprocessor materials</title>
   	 <description>(PhysOrg.com) -- An MIT team led by Tom&amp;aacute;s Palacios, assistant professor in the Department of Electrical Engineering and Computer Science, has succeeded in combining two semiconductor materials, silicon and gallium nitride, that have different and potentially complementary characteristics, into a single hybrid microchip. This is something researchers have been attempting to do for decades. </description>
     <link>http://www.physorg.com/news172316465.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Wed, 16 Sep 2009 10:43:14 EST</pubDate>
	 <guid isPermaLink="false">news172316465</guid>
</item>
<item>
     <title>Taiwan's chip makers still face dangers: analysts</title>
   	 <description>Taiwan's chip makers, powerful drivers of growth on the island, may have survived their worst crisis ever, but lacklustre sales and new rivals still make these risky times.</description>
     <link>http://www.physorg.com/news172300918.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Wed, 16 Sep 2009 06:40:01 EST</pubDate>
	 <guid isPermaLink="false">news172300918</guid>
</item>
<item>
     <title>Elpida Completes Development of Cu-TSV (Through Silicon Via) Multi-Layer 8-Gigabit DRAM</title>
   	 <description>Elpida Memory today announced that it has completed development of a Cu-TSV (Through Silicon Via) multi-layer 8-Gigabit DRAM.</description>
     <link>http://www.physorg.com/news170952515.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Mon, 31 Aug 2009 16:00:02 EST</pubDate>
	 <guid isPermaLink="false">news170952515</guid>
</item>
<item>
     <title>Semiconductor revenue forecast to fall 17 pct</title>
   	 <description>Worldwide semiconductor revenue is expected to decline 17.1 percent this year compared with last year, market research firm Gartner said Wednesday.</description>
     <link>http://www.physorg.com/news170503731.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Wed, 26 Aug 2009 11:40:01 EST</pubDate>
	 <guid isPermaLink="false">news170503731</guid>
</item>
<item>
     <title>TSMC Achieves 28nm SRAM Yield Breakthrough</title>
   	 <description>Taiwan Semiconductor Manufacturing Company has become the first foundry not only to achieve 28nm functional 64Mb SRAM yield, but also to achieve it across all three 28nm nodes.</description>
     <link>http://www.physorg.com/news170353677.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Mon, 24 Aug 2009 19:10:01 EST</pubDate>
	 <guid isPermaLink="false">news170353677</guid>
</item>
<item>
     <title>Organic electronics a two-way street, thanks to new plastic semiconductor</title>
   	 <description>(PhysOrg.com) -- Plastic that conducts electricity holds promise for cheaper, thinner and more flexible electronics. This technology is already available in some gadgets -- the new Sony walkman that was introduced earlier this summer and the Microsoft Zune HD music player released last week both incorporate organic light-emitting electronic displays.</description>
     <link>http://www.physorg.com/news169736246.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Mon, 17 Aug 2009 13:58:12 EST</pubDate>
	 <guid isPermaLink="false">news169736246</guid>
</item>
<item>
     <title>'Printed chips' could be boon for consumers</title>
   	 <description>Until now, creating the microchips that power all of our electronic gadgets has been a laborious, complex and time-consuming process costing billions of dollars. But if a Milpitas, Calif.-based startup succeeds, making them could be as easy as printing a piece of paper.</description>
     <link>http://www.physorg.com/news169319540.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Wed, 12 Aug 2009 18:13:15 EST</pubDate>
	 <guid isPermaLink="false">news169319540</guid>
</item>
<item>
     <title>Intel, Micron Achieve Industry`s Most Efficient NAND Product Using 3-Bit-Per-Cell Technology</title>
   	 <description>Intel Corporation and Micron Technology today announced the development of a new 3-bit-per-cell (3bpc) multi-level cell (MLC) NAND technology, leveraging their award-winning 34-nanometer NAND process. The chips are typically used in consumer storage devices such as flash cards and USB drives, where high density and cost-efficiency are paramount. </description>
     <link>http://www.physorg.com/news169219912.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Tue, 11 Aug 2009 14:50:01 EST</pubDate>
	 <guid isPermaLink="false">news169219912</guid>
</item>
<item>
     <title>Modelling nano-worlds</title>
   	 <description>(PhysOrg.com) -- Modelling the fabrication processes for integrated circuits can slash production development time and costs by up to 40%. But as transistors, already at nano-scales, become ever smaller, researchers are modelling new worlds. Over the past seven years, the microprocessors in everyday electronic equipment have delivered astonishing advances in speed while reducing power consumption per transistor.</description>
     <link>http://www.physorg.com/news169134954.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Mon, 10 Aug 2009 15:10:01 EST</pubDate>
	 <guid isPermaLink="false">news169134954</guid>
</item>
<item>
     <title>The perfect cut</title>
   	 <description>You need the right tool to slice silicon blocks into paper-thin wafers: a several-kilometer-long wire wetted with a type of grinding paste. And all the parameters must be optimally adjusted -- only then can significant material losses be avoided during the cutting process.</description>
     <link>http://www.physorg.com/news168858869.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Fri, 07 Aug 2009 10:30:01 EST</pubDate>
	 <guid isPermaLink="false">news168858869</guid>
</item>
<item>
     <title>Smaller, cheaper cell phones possible  </title>
   	 <description>(PhysOrg.com) -- Ph.D. candidate Sataporn Pornpromlikit played a critical role in research at UC San Diego that made a big impact at a recent conference, and might provide manufacturers with the means for making cell phones both smaller and cheaper.</description>
     <link>http://www.physorg.com/news168271189.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Fri, 31 Jul 2009 15:00:20 EST</pubDate>
	 <guid isPermaLink="false">news168271189</guid>
</item>
<item>
     <title>45-nanometer chips for ultra-fast WiFi</title>
   	 <description>(PhysOrg.com) -- Powerful new radio technologies that promise blisteringly fast WiFi have been given a boost by a team of European researchers` cutting-edge work on miniscule microchips.</description>
     <link>http://www.physorg.com/news168099929.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Wed, 29 Jul 2009 15:50:01 EST</pubDate>
	 <guid isPermaLink="false">news168099929</guid>
</item>
<item>
     <title>SKorean firms to jointly develop new chips</title>
   	 <description>Samsung Electronics will lead a group of South Korean firms in jointly developing advanced semiconductors used for smartphones and digital televisions, officials said Monday.</description>
     <link>http://www.physorg.com/news167905954.html</link>
	 <category>Technology - Semiconductors</category>
	 <pubDate>Mon, 27 Jul 2009 09:33:12 EST</pubDate>
	 <guid isPermaLink="false">news167905954</guid>
</item>


</channel>
</rss>

