Search results for 65nm
AMD Orders Applied Materials Systems to Equip 300mm Fab
Dec 16, 2004 |
5 / 5 (1) |
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Applied Materials, Inc. received orders from Advanced Micro Devices, Inc. (AMD) for 300mm equipment to manufacture its future advanced 65nm-generation 64-bit microprocessors. The orders cover a broad range of process technologies, ...
UMC's Researchers Extend Traditional Nitrided Gate-oxide to beyond the 65nm node
Jun 16, 2005 |
2.3 / 5 (4) |
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Nitrogen profile engineering used to downscale effective oxide thickness towards 1nm to improve semiconductor performance UMC, a world leading semiconductor foundry, today announced that its research and development team ...
Intel Discloses Details of Intel Core Microarchitecture
Mar 07, 2006 |
4.3 / 5 (7) |
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Intel Corporation today disclosed details of its forthcoming Intel Core microarchitecture, a new industry–leading foundation for Intel's multi–core server, desktop and mobile processors for computers later ...
Fujitsu Develops Technology for Low-Power, High-Performance 45nm Logic Chips
Jun 18, 2007 |
5 / 5 (6) |
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Fujitsu today announced the development of a platform technology for 45 nanometer generation LSI logic chips, which combines technologies for low power consumption and high-performance interconnect.
ARM Introduces Industry's Fastest Processor For Low-Power Mobile And Consumer Applications
Oct 04, 2005 |
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ARM today announced its new Cortex-A8 processor which will revolutionize consumer and low-power mobile devices, enabling the delivery of higher levels of entertainment and innovation to end users. Launched at the second annual ...
Samsung Joins IBM and Chartered on 90-Nanometer Common Design-Enablement Platform
May 24, 2005 |
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IBM, Chartered Semiconductor Manufacturing and Samsung Electronics Co., Ltd, today announced that Samsung has licensed the 90-nanometer common design enablement technology utilized by IBM and Chartered. As a result of this ...
Applied Materials Launches Breakthrough Single-Wafer High-Current Quantum X Implanter
Jun 29, 2004 |
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Applied Materials, Inc. today introduced its breakthrough Applied Quantum(TM) X ion implanter, a single-wafer high-current system that enables transistor scaling to the 65nm node and beyond. The Quantum X system's high tilt ...
Applied Materials Releases Breakthrough Gap-Fill Technology with Applied Producer HARP System
Jul 08, 2004 |
3 / 5 (3) |
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Applied Materials, Inc. launches its breakthrough Applied Producer(R) HARP(TM) (high aspect ratio process) system, the only commercially available CVD technology that meets the stringent 65nm and below, greater than 7:1 hi ...
Show Must Go On: Intel Keeps Moore's Law on Track with 65 nm Technology
Aug 30, 2004 |
1 / 5 (1) |
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A significant milestone in developing next-generation chip manufacturing technology has been achieved by Intel Corporation. The company has built fully functional 70-megabit static random access memory (SRAM) c ...
NEC announced multi- level Cu/Low-k interconnects for second generation 65nm-node VLSIs
Jun 18, 2004 |
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NEC Corporation and NEC Electronics Corporation announced that they have succeeded in the development of multi- level Cu/Low-k interconnects for second generation 65nm-node VLSIs. By improving the interconnect structure and ...
193nm Immersion litho on track for 45nm half pitch
Sep 22, 2005 |
2.8 / 5 (4) |
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Demonstrating significant progress in all aspects of the technology, 193nm immersion lithography is on track for insertion into volume manufacturing, with good prospects for extendibility to subsequent generations, concluded ...
Applied Materials Launches Breakthrough 45nm PVD Copper Barrier/Seed Technology
Dec 04, 2004 |
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Applied Materials, Inc. today introduced the Applied Endura CuBS II, a breakthrough system that enables PVD copper barrier/seed deposition at 45nm and beyond. The system's new SIP EnCoRe II process chambers feature novel, ...
Applied Materials Unlocks the Future of Defect Inspection with Breakthrough UVision System
Jun 06, 2005 |
1 / 5 (1) |
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Applied Materials, Inc. revolutionizes defect inspection with its innovative Applied UVision system, the semiconductor industry's first laser 3D brightfield inspection tool. The UVision system targets chipmakers' vital need ...
Applied Materials Strengthens Leadership Position in HDP-CVD; Ships 100th 300mm System
Jun 15, 2004 |
2.3 / 5 (3) |
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SANTA CLARA, Calif.--June 15, 2004--Applied Materials, Inc. demonstrates its market leadership in HDP-CVD(1) technology for the sixth straight year with the shipment of its 100th Applied Centura(R) Ultima(TM) HDP-CVD system ...
New Concept for Novel Low-k Film Compatible with 45nm-node LSI Interconnects
Jun 15, 2005 |
3.5 / 5 (2) |
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NEC and MIRAI Project today announced the joint development of a low dielectric-constant (low-k) film, which is realized through a newly developed concept, and is expected to lead to power reduction in advanced LSIs. The ...
