Search results for 65nm:
AMD Orders Applied Materials Systems to Equip 300mm Fab
Dec 16, 2004 |
5 / 5 (1) |
1
Applied Materials, Inc. received orders from Advanced Micro Devices, Inc. (AMD) for 300mm equipment to manufacture its future advanced 65nm-generation 64-bit microprocessors. The orders cover a broad range of process technologies, ...
STMicroelectronics Unveils Advanced Non-Volatile Memory and Advanced CMOS Platform Developments
Dec 10, 2004 |
2 / 5 (1) |
0
STMicroelectronics, one of the world's leading suppliers of semiconductor devices, will participate as presenter or co-author in fifteen papers at the IEDM 2004 (International Electron Devices Meeting) Conference, which takes ...
Philips highlights leading consumer-oriented semiconductor R&D at IEDM 2004
Dec 08, 2004 |
not rated yet |
0
Record-breaking performance of 90-nm RF CMOS process takes advanced development to new levels At this year's IEEE International Electron Devices Meeting (IEDM, San Francisco, USA, 13 - 15 December 2004), Philips' R&D scientis ...
Applied Materials Launches Breakthrough 45nm PVD Copper Barrier/Seed Technology
Dec 04, 2004 |
not rated yet |
0
Applied Materials, Inc. today introduced the Applied Endura CuBS II, a breakthrough system that enables PVD copper barrier/seed deposition at 45nm and beyond. The system's new SIP EnCoRe II process chambers feature novel, ...
Applied Materials Releases Industry's Fastest, Most Powerful Defect Review Systems with New SEMVision G2 Family
Dec 04, 2004 |
1 / 5 (1) |
0
Applied Materials, Inc. today unveiled the Applied SEMVision G2 family, the industry's fastest, most sensitive line of defect review and analysis tools for 65nm manufacturing and beyond. The new line of three systems sets ...
Industry's First 2-Gigabit DDR2 SDRAM
Sep 20, 2004 |
3 / 5 (2) |
0
Samsung Electronics Co., Ltd., the leader in advanced semiconductor technology, today announced the industry's first 2-Gigabit (Gb) DDR2 SDRAM utilizing 80-nanometer (nm) process technology. The high densit ...
Show Must Go On: Intel Keeps Moore's Law on Track with 65 nm Technology
Aug 30, 2004 |
1 / 5 (1) |
0
A significant milestone in developing next-generation chip manufacturing technology has been achieved by Intel Corporation. The company has built fully functional 70-megabit static random access memory (SRAM) c ...
Major Breakthrough in Planarization Technology: Applied Materials Announced Revolutionary 300mm Applied Reflexion LK Ecm
Jul 12, 2004 |
5 / 5 (1) |
0
Applied Materials, Inc. announces a major breakthrough in planarization technology with its revolutionary 300mm Applied Reflexion LK Ecmp(TM) system. Introducing innovative electro-chemical mechanical planarization (Ecmp) ...
65nm Revolution: Applied Materials Leads the Semiconductor Equipment Industry
Jul 11, 2004 |
5 / 5 (1) |
0
Applied Materials, Inc. showcased the industry's largest portfolio of 65nm chip manufacturing systems at SEMICON West, with a full complement of transistor, interconnect and inspection solutions for fabricating next-generation ...
Applied Materials Releases Breakthrough Gap-Fill Technology with Applied Producer HARP System
Jul 08, 2004 |
3 / 5 (3) |
0
Applied Materials, Inc. launches its breakthrough Applied Producer(R) HARP(TM) (high aspect ratio process) system, the only commercially available CVD technology that meets the stringent 65nm and below, greater than 7:1 hi ...
Applied Materials Launches Breakthrough Single-Wafer High-Current Quantum X Implanter
Jun 29, 2004 |
not rated yet |
0
Applied Materials, Inc. today introduced its breakthrough Applied Quantum(TM) X ion implanter, a single-wafer high-current system that enables transistor scaling to the 65nm node and beyond. The Quantum X system's high tilt ...
NEC announced multi- level Cu/Low-k interconnects for second generation 65nm-node VLSIs
Jun 18, 2004 |
not rated yet |
0
NEC Corporation and NEC Electronics Corporation announced that they have succeeded in the development of multi- level Cu/Low-k interconnects for second generation 65nm-node VLSIs. By improving the interconnect structure and ...
TEXAS INSTRUMENTS RESEARCHERS OUTLINE PATHS TO REDUCE CHIP POWER CONSUMPTION, INCREASE PERFORMANCE
Jun 15, 2004 |
not rated yet |
0
Technical Disclosures Present New Options for Chip Scaling DALLAS (June 15, 2004) - Texas Instruments Incorporated announced its semiconductor research teams have developed cost effective techniques to dramatically lower chi ...
Applied Materials Strengthens Leadership Position in HDP-CVD; Ships 100th 300mm System
Jun 15, 2004 |
2.3 / 5 (3) |
0
SANTA CLARA, Calif.--June 15, 2004--Applied Materials, Inc. demonstrates its market leadership in HDP-CVD(1) technology for the sixth straight year with the shipment of its 100th Applied Centura(R) Ultima(TM) HDP-CVD system ...
IBM Introduces Advanced Design Methodology to Increase Performance and Reduce Power Consumption in Custom Chips
Jun 11, 2004 |
not rated yet |
0
SAN DIEGO, CA -- Jun 9, 2004 -- IBM today introduced an industry-first timing flow created to maximize performance and minimize power consumption in next-generation custom chips. Called 'variation-aware timing', this revo ...
