Search results for multi-chip package
Elpida Unveils Industry's First 2-Gigabit DDR2 Mobile RAM
Sep 29, 2009 |
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Elpida Memory, Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had developed the industry's first 2-gigabit DDR2 Mobile RAM.
Samsung Develops Advanced Packaging Technology to Achieve a 0.6mm-thick 8-chip Package
Nov 05, 2009 |
5 / 5 (2) |
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Samsung Electronics announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory ...
Elpida Completes Development of Cu-TSV (Through Silicon Via) Multi-Layer 8-Gigabit DRAM
Aug 31, 2009 |
4.8 / 5 (4) |
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Elpida Memory today announced that it has completed development of a Cu-TSV (Through Silicon Via) multi-layer 8-Gigabit DRAM.
Samsung Reveals Industry's First Gigabit-density Mobile DRAM
Dec 27, 2006 |
1.7 / 5 (3) |
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Samsung Electronics announced that it has developed the industry's first one gigabit (Gb) Mobile DRAM (dynamic random access memory) for mobile products, using 80nm process technology.
Samsung Develops World's First Eight-Die Multi-Chip Package Technology for Multimedia Cell Phones
Jan 10, 2005 |
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Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the world's first eight-die multi-chip package (MCP) technology, designed for use in high-capacity mobile devices s ...
Elpida Completes Development of New 50nm Process 2-Gigabit Mobile RAM
Dec 10, 2008 |
4 / 5 (1) |
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Elpida Memory today announced that it had completed development of a 50nm process 2-gigabit Mobile RAM product using 50nm process technology with 193nm (ArF) immersion lithography and copper interconnect.
World’s Largest-capacity Multi-chip Package for Mobile Applications
Feb 23, 2005 |
3 / 5 (1) |
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Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it is mass producing the world's largest-capacity multi-chip package (MCP). The new 2.5Gb MCP will enable multimedia-intensive ...
New Wireless 60 GHz Standard Promises Ultra-Fast Applications
Jan 15, 2009 |
4.4 / 5 (10) |
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(PhysOrg.com) -- Ultra-high-speed wireless connectivity - capable of transferring 15 gigabits of data per second over short distances - has taken a significant step toward reality. A recent decision by an ...
Samsung Announces Advanced Multi-standard, Multi-band Mobile TV Chipset
Jun 27, 2007 |
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Samsung Electronics announced the industry's first 65 nanometer (nm) multi-standard channel decoder (S3C4F31) and multi-band radio frequency (RF) tuner (S5M8602) chipset which supports multi digital mobile ...
Briefs: STM delivers new wireless-phone chip set
Feb 23, 2006 |
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A new multi-chip package designed for 3G and CDMA mobile phones and carrying 1 GB of Flash memory was unveiled Thursday by STMicroelectronics.
Intel, Micron First to Deliver Sub-40 Nanometer NAND Flash Memory Device
May 29, 2008 |
3.2 / 5 (9) |
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Today Intel Corporation and Micron Technology, Inc. introduced the industry's first sub-40 nanometer NAND memory device, unveiling a 34nm 32 gigabit multi-level cell chip. This process technology was jointly ...
NEC Develops a Three-Dimensional Chip-Stacked Flexible Memory
Feb 10, 2009 |
2.3 / 5 (3) |
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NEC Corporation announced today the development of chip-stacked flexible memory, which can be used to achieve a new system-on-chip (SoC) architecture. The new SoC's architecture consists of separate logic ...
Samsung Develops 3D Memory Package that Greatly Improves Performance Using Less Space
Apr 13, 2006 |
4.3 / 5 (6) |
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Samsung Electronics announced today that it has developed a small-footprint, wafer-level processed stack package (WSP) of high density memory chips using 'through silicon via' (TSV) interconnection technology. WSP actually ...
New 167-processor chip is super-fast, ultra energy-efficient
Apr 22, 2009 |
4.7 / 5 (21) |
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A new, extremely energy-efficient processor chip that provides breakthrough speeds for a variety of computing tasks has been designed by a group at the University of California, Davis. The chip, dubbed AsAP, is ultra-small, ...
Nanophotonic switch device for routing light on a chip scale
Mar 17, 2008 |
4.6 / 5 (44) |
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IBM scientists today took another significant advance towards sending information inside a computer chip by using light pulses instead of electrons by building the world’s tiniest nanophotonic switch with ...
