Search results for +"DDR" :
 Transcend Introduces New aXeRam Overlocking Memory KitThe new DDR aXeRam Overlocking Memory Kit has received favorable comments by system builders and enthusiasts. The new product provides low voltage stability, and low CAS latency. This high performance memory ... |
 Samsung Reveals Industry's First Gigabit-density Mobile DRAMSamsung Electronics announced that it has developed the industry's first one gigabit (Gb) Mobile DRAM (dynamic random access memory) for mobile products, using 80nm process technology. |
Rambus grants Toshiba new patent licenseHigh-speed chip interface licensing company Rambus Inc. announced Wednesday it has signed a new patent license agreement with Toshiba Corporation. |
Interview: Alienware's gaming challengeChildhood friends and Alienware co-founders Nelson Gonzalez and Alex Aguila never thought their love for computer games would lead to a place out of this world. Together, they have nurtured Alienware to become a major manufacturer ... |
 Samsung Offers 8GB FB-DIMM for ServersSamsung Electronics today announced a new 8GB server memory offering. Following the introduction of its 8GB Registered Dual In-line Memory Module (R-DIMM) in October, Samsung has now increased the density of ... |
 I Want More: Dual-Core Notebook OfferedWidowPC, a leader in cutting-edge PC hardware, announced the availability of the long-awaited, dual-core notebook, the Sting 917X2. Featuring the Athlon 64 X2 Dual-Core Processor by AMD, the system is fully ... |
 Study Produces Road Map for NanomanufacturingResearchers have taken an important step toward high-volume production of new nanometer-scale structures with the first systematic study of growth conditions that affect production of one-dimensional nanostructures ... |
Finnish over-clockers break 1 GHz graphics processor speed barrierAn independent team of Finnish over-clockers has made world history by over-clocking a graphics processor to engine clock levels above 1 GHz. The record was set on the recently-announced Radeon X1800 XT graphics processor ... |
Spansion Introduces Innovative Package-On-Package Solution To Reduce Wireless Device SizeSpansion LLC, the Flash memory venture of AMD and Fujitsu Limited, today announced it is shipping Package-on-Package (PoP) Flash memory samples to customers that will enable them to deliver sleek, feature-rich wireless phones, ... |
 Nanohelix structure provides new building block for nanoscale piezoelectric devicesBased on superlattice nanobelts
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CELSIUS V830 workstation with AMD64 technologyAMD today announced that Fujitsu Siemens Computers, a leading European IT provider, is offering a new series of workstations based on the AMD Opteron processor. The CELSIUS V830 supports the Dual-Core AMD Opteron processor ... |
EMC Announces World's Largest, Fastest and Most Scalable High-End Storage ArrayEMC Corporation announced the largest, fastest and most scalable high-end storage array in the world, capable of providing leading functionality while scaling to one petabyte (1,024 terabytes) of capacity. The new Symmetrix ... |
Elpida Memory's 512 Megabit Mobile RAM Device Fits in Smaller Package for 3G PhonesJul 13, 2005 | pda version
90 nm Process Technology Enables Smaller Die Size, Easier Implementation in Multi-Chip-Package and System-in-Package Designs
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Dell Brings Intel Dual-Core Technology to Servers for Small BusinessesDell today announced the PowerEdge SC430 will be among the first servers to feature the enhanced performance enabled by Intel's new dual-core processor technology. |
Micron Introduces Very Low Profile Memory Modules in the 512 Mb and 1 Gb DensitiesJun 29, 2005 | pda version
Micron Technology, Inc., today announced the availability of 512 megabyte and 1 gigabyte double data rate (DDR) and DDR2 very low profile (VLP) registered dual-inline memory modules (RDIMMs). Micron's VLP DDR RDIMMs are designed ... |
