Search results for SiGen

Apr 18, 2006

SiGen Announces Breakthrough in Direct Silicon Bond Substrate Technology

Silicon Genesis Corporation (SiGen) announced today that it has developed the process modifications to manufacture direct silicon bonded substrates. Direct silicon bond (DSB) substrates are fabricated by bonding and electrically ...

Oct 4, 2004

SiGen Granted Key Strained-Silicon Substrate Patent

Silicon Genesis Corporation (SiGen) announced today that it has received a key patent in the area of fabricating strained silicon and silicon-on-insulator (SOI) substrates using a layer transfer process used in next-generation ...

Aug 11, 2004

Breakthrough in Silicon Technology: Wafer-Level Strained Silicon Technology Announced by SiGen

Silicon Genesis Corporation (SiGen) announced today that it has successfully developed a new wafer-level strained substrate technology, called “Next-Generation Strain” or NGS. NGS features uniaxial strain instead of biaxial ...