Search results for +"high-k" :
 New Intel-Based Laptops Advance All Facets of Notebook PCsIntel Corporation unveiled its Intel Centrino 2 Processor Technology products for laptops today, powered by five new Intel Core2 Duo processors. Close to 250 innovative consumer and business notebook PC designs ... |
 IMEC reports major progress in EUVJul 14, 2008 | pda version
IMEC reports functional 0.186µm2 32nm SRAM cells made with FinFETs from which the contact layer was successfully printed using ASML’s full field extreme ultraviolet (EUV) Alpha Demo Tool (ADT). Applied Materials, ... |
 Intel Introduces New Atom Processors for Mobile Internet DevicesIntel Corporation today introduced five new Intel Atom processors and Intel Centrino Atom processor technology for Mobile Internet Devices (MIDs) and embedded computing solutions. |
New Intel Server Processors: Fewer Watts, High PerformanceIntel Corporation has further increased its energy-efficient performance lead today with the introduction of two low-voltage 45 nanometer processors for servers and workstations that run at 50 watts, or just 12.5 watts per ... |
Intel Ships New Processors Based on 45-nanometer ProcessIntel Corporation today announced expanded offerings for embedded market segments with new processors with extended, 7-year life cycle support, a new chipset and a carrier-grade server. The processors, based on Intel's high-k, ... |
 Breaking the performance barrier of 22-nm CMOS technologyA major initiative has been launched in Europe with a top-ranked project called DUALLOGIC, Dual channel CMOS for (sub)-22 nm high performance logic. |
 IBM Alliances Announce Advancement in High-K/Metal Gate TechnologyIBM and its joint development partners -- AMD, Chartered Semiconductor Manufacturing, Freescale, Infineon, and Samsung -- announced an innovative approach to speed the implementation of a breakthrough material ... |
 IMEC increases performance of high-k metal gate planar CMOS and FinFETsAt today’s IEEE International Electron Devices Meeting, IMEC reports significant progress in improving the performance of planar CMOS using hafnium-based high-k dielectrics and tantalum-carbide metal gates ... |
 Novel gate dielectric materials: perfection is not enoughFor the first time theoretical modeling has provided a glimpse into how promising dielectric materials are able to trap charges, something which may affect the performance of advanced electronic devices. This ... |
Intel Demonstrates Industry's First 32nm Chip and Next-Generation Nehalem Microprocessor ArchitectureIntel Corporation President and CEO Paul Otellini today outlined new products, chip designs and manufacturing technologies that will enable the company to continue its quickened pace of product and technology leadership. |
Sematech Reveals Details on Practical High-K Metal Gate Systems for 45nm And BeyondBuilding on their successful CMOS solution for gate‑first, thermally stable, high-k dual metal gates, SEMATECH researchers have released further data that portends a new era in which future transistor scaling is dominated ... |
 SEMATECH and NIST Collaborate on Chemical Analysis of Advanced Gate DielectricsNitrogen incorporation in thin HfO2/SiO2 film systems representative of high-k gate dielectric layers in advanced metal-oxide semiconductor field-effect transistors (MOSFETs) has been ... |
Hynix joins IMEC's (sub-)32nm CMOS research platformHynix Semiconductor has entered into a strategic partnership with IMEC, Europe’s leading independent nanoelectronics research center, to perform research and development for the (sub)-32nm memory process generations. |
Solutions Emerging for Wafer Cleaning at 45 nm and BeyondPotential solutions are starting to emerge for preparing wafers for manufacturing at and beyond the 45 nm technology generation, technologists indicated at a recent industry meeting organized by SEMATECH. |
IDF, Day Two: Intel Talks Mobile Roadmaps, Next-Gen UMPC Platforms, and Silicon ScalingDuring day two of the Intel Developer's Forum in Beijing, Intel executives are expected to discuss the company's future plans for mobile processors, including a next-generation UMPC platform based on a 45-nm, high-k low power ... |
