The launch of Intel's multiprocessor platform for servers will complete the company's transition to its Core microarchitecture, first introduced in 2006.
Samsung Electronics today announced that it has developed the first all-DRAM stacked memory package using 'through silicon via' (TSV) technology, which will soon result in memory packages that are faster, smaller and consume ...
Samsung Electronics today announced that it has developed the first all-DRAM stacked memory package using ‘through silicon via’ (TSV) technology, which will soon result in memory packages that are faster, smaller and ...
Samsung Electronics, the world leader in advanced memory technology, announced today mass production of 1Gigabit (Gb) DDR2 DRAM memory using 80 nanometer (nm) process technology. While monolithic 1Gb DDR2 is available today, ...
Intel Corporation today introduced its dual-core Intel Xeon Processor 5100 series, previously codenamed “Woodcrest,” for the high-volume server, workstation, communications, storage and embedded market segments.
Intel today disclosed record breaking results on 20 key dual-processor (DP) server and workstation benchmarks. The first processor due to launch based on the new Intel Core microarchitecture — the Dual-Core Intel Xeon processor ...
Elpida Memory today announced the availability of its second-generation 1 Gigabit DDR2 SDRAMs and six memory modules based on the new devices.
Rambus said Tuesday it has signed a five-year licensing agreement with Advanced Micro Devices, giving AMD a license to Rambus patents.
Elpida Memory, Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced the shipment of 80 nm-based 2 Gigabit DDR2 SDRAM samples. These samples are among the first 80 nm-based devices in the ...
Samsung Electronics today announced a new 8GB server memory offering. Following the introduction of its 8GB Registered Dual In-line Memory Module (R-DIMM) in October, Samsung has now increased the density of its Fully Buffered ...
