Search results for PVD
IMEC increases performance of high-k metal gate planar CMOS and FinFETs
Dec 11, 2007 |
3.8 / 5 (5) |
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At today’s IEEE International Electron Devices Meeting, IMEC reports significant progress in improving the performance of planar CMOS using hafnium-based high-k dielectrics and tantalum-carbide metal gates ...
Study looks at off-label use of biliary stents
Jan 21, 2008 |
5 / 5 (1) |
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Although approved by the U.S. Food and Drug Administration as a palliative treatment for cancer patients who have developed bile-duct obstructions, biliary stents are sometimes used “off-label” for the treatment of peripheral ...
Tegal Awarded Key Patent For New Magnetron Sputter Source
Dec 20, 2004 |
1 / 5 (1) |
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New sputter source represents break through in target efficiency - provides significant cost savings to chip manufacturers Tegal Corporation announced that it has been granted United States Patent, No. 6,783,638 for the ...
Applied Materials Launches Breakthrough 45nm PVD Copper Barrier/Seed Technology
Dec 04, 2004 |
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Applied Materials, Inc. today introduced the Applied Endura CuBS II, a breakthrough system that enables PVD copper barrier/seed deposition at 45nm and beyond. The system's new SIP EnCoRe II process chambers feature novel, ...
Samsung Develops 70-nanometer DRAM Process Technology
May 28, 2004 |
5 / 5 (1) |
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The industry’s first development of 70-nanometer DRAM process technology employing the CVD method Samsung Electronics announced that it has developed the industry’s first “CVD aluminum” process technology, the very latest ...
Applied Materials Announces Breakthrough in Interface Engineering Technology for 65-45nm Transistors
Sep 20, 2005 |
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Applied Materials, Inc. today announced a key advancement in nano-scale interface engineering with its new Applied Siconi Preclean process for fabricating leading-edge transistor contacts.
Applied Materials Announces Advanced CVD Aluminum Technology
Dec 06, 2005 |
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Applied Materials, Inc. today announced its Applied CVD Al process chamber for building current and next-generation high-density interconnects in Flash and DRAM memory chips. Using aluminum deposition technology, which continues ...
Applied Materials, IMEC Team to Develop Innovative 32nm, 22nm Interconnects
Jan 24, 2006 |
2.8 / 5 (4) |
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Applied Materials and IMEC, Europe's leading independent nanoelectronics and nanotechnology research center, announced today a significant joint effort to develop 32nm and 22nm-node copper/low k interconnect ...
Scientists Formulate Intelligent Glass That Blocks Heat Not Light
Physics /
Aug 10, 2004 |
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Soaring air conditioning bills or suffering in the sweltering heat could soon be a thing of the past, thanks to UCL chemists. Reporting in the Journal of Materials Chemistry, researchers reveal they have developed an intellig ...
AMD Orders Applied Materials Systems to Equip 300mm Fab
Dec 16, 2004 |
5 / 5 (1) |
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Applied Materials, Inc. received orders from Advanced Micro Devices, Inc. (AMD) for 300mm equipment to manufacture its future advanced 65nm-generation 64-bit microprocessors. The orders cover a broad range of process technologies, ...
STMicroelectronics Unveils Advanced Non-Volatile Memory and Advanced CMOS Platform Developments
Dec 10, 2004 |
2 / 5 (1) |
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STMicroelectronics, one of the world's leading suppliers of semiconductor devices, will participate as presenter or co-author in fifteen papers at the IEDM 2004 (International Electron Devices Meeting) Conference, which takes ...
