Infineon Technologies AG and Bundesdruckerei GmbH have developed a new security smart card with an LED display and a one-time password. This new technology is centred around a security chip in the card which generates a one-time ...
Hardware
Mar 6, 2013
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(Phys.org)—Nanotechnology is such a new innovation that no one is really sure what will come of it. Predictions range from the ability to reproduce things like diamonds and food, to the world being devoured by self-replicating ...
Bio & Medicine
Feb 13, 2013
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(PhysOrg.com) -- Small. Fast. Precise. A new electronics manufacturing technology developed at NDSU’s Center for Nanoscale Science and Engineering eliminates challenges facing conventional packaging techniques and shows ...
Electronics & Semiconductors
Nov 18, 2011
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Samsung Electronics today announced the development of 32 gigabyte (GB) double data rate-3 (DDR3) registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) through silicon via (TSV) package technology.
Hardware
Aug 18, 2011
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Imec and its project partners announce the launch of the European FP7 (Framework Program) project PASTA (Integrating Platform for Advanced Smart textile Applications) aiming at developing large-area smart textiles. Large-area ...
Engineering
Nov 3, 2010
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Carnegie Mellon University and Intel Corporation will unveil a new class of materials called solder magnetic nanocomposites that could help streamline the process of computer electronic packaging. The milestone research will ...
Nanomaterials
Jan 19, 2010
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Samsung Electronics announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory package is just ...
Electronics & Semiconductors
Nov 5, 2009
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In the quest to pack ever-smaller electronic devices more densely with integrated circuits, nanotechnology researchers keep running up against some unpleasant truths: higher current density induces electromigration and thermomigration, ...
Nanomaterials
Mar 20, 2009
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