Intel Mobile Communications today announced shipment of its XMM 6260 platform to key customers. Optimized for smart phone architectures coupled with an application processor or as a standalone solution for PC modems and data ...
Electronics & Semiconductors
Feb 14, 2011
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Infineon Technologies today at the Mobile World Congress 2010 announced the availability of XMM 6260, the latest platform in its 3G slim-modem family.
Electronics & Semiconductors
Feb 15, 2010
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(AP) -- Chicago, Dallas, Houston, Los Angeles, Miami and Charlotte, N.C., will be the first cities to see the benefits of AT&T's plans to double the data download speeds on its wireless network. The six cities will be upgraded ...
Telecom
Sep 9, 2009
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Motorola, today introduced the H24, the latest addition to its Machine-to-Machine (M2M) solutions portfolio. The new HSPA wireless module was designed to meet the M2M industry’s growing need for high-speed 3.5G connectivity. ...
Telecom
Mar 30, 2009
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